Radisys P1366BX-SVE工业模块

Radisys P1366BX-SVE工业模块 是一款专为工业应用设计的计算机板卡，提供高性能的计算能力和可靠性。

Radisys P1366BX-SVE工业模块 详情介绍：

Radisys的P1366BX-SVE工业模块是一款用于高性能计算和通信应用的嵌入式模块。以下是该模块的主要特点和规格：

主要特点：

1. 处理器支持：P1366BX-SVE支持基于Intel的处理器架构，通常采用高性能的Intel Xeon处理器或类似的工业级处理器，以满足高计算能力和多线程处理的需求。
2. 内存容量：支持大容量的内存配置，通常为DDR3或DDR4 RAM，满足高带宽和高存储需求的应用。
3. 存储选项：通常提供多种存储选项，包括SATA、SAS接口，支持SSD或HDD存储设备。
4. 扩展插槽：包含多个PCIe插槽，用于扩展和连接其他外部设备或模块。
5. 网络接口：提供多个网络接口，包括高速以太网接口，支持高数据传输速率和低延迟通信。
6. I/O接口：包括多种输入输出接口，如USB、串口（RS-232/RS-422/RS-485）、GPIO等，支持各种外部设备和系统集成。
7. 散热设计：工业级设计通常包括有效的散热解决方案，以确保模块在恶劣环境下稳定运行。
8. 尺寸和形状：模块的尺寸通常符合标准的工业机架或嵌入式系统规格，便于集成到各种机箱和系统中。

应用领域：

• 通信设备：用于电信基站、路由器和交换机等设备，支持高吞吐量和低延迟的网络通信。
• 工业控制：在工业自动化和控制系统中应用，用于实时数据处理和控制。
• 医疗设备：在医疗影像和数据处理设备中使用，提供高性能计算能力。
• 军事和国防：适用于要求严格的环境和性能标准的军事和国防应用。

Radisys P1366BX-SVE工业模块 实物图片：

english introduction:

Radisys' P1366BX-SVE industrial module is an embedded module designed for high-performance computing and communication applications. The following are the main features and specifications of this module:

Main features:

Processor support: P1366BX-SVE supports Intel based processor architecture, typically using high-performance Intel Xeon processors or similar industrial grade processors to meet the needs of high computing power and multi-threaded processing.

Memory capacity: Supports high-capacity memory configurations, typically DDR3 or DDR4 RAM, to meet applications with high bandwidth and storage requirements.

Storage options: Multiple storage options are typically provided, including SATA, SAS interfaces, and support for SSD or HDD storage devices.

Expansion Slot: Contains multiple PCIe slots for expanding and connecting other external devices or modules.

Network interface: Provides multiple network interfaces, including high-speed Ethernet interface, supporting high data transmission rate and low latency communication.

I/O interface: including various input and output interfaces, such as USB, serial port (RS-232/RS-422/RS-485), GPIO, etc., supporting various external devices and system integration.

Heat dissipation design: Industrial grade design typically includes effective heat dissipation solutions to ensure stable operation of modules in harsh environments.

Size and shape: The size of the module usually conforms to standard industrial rack or embedded system specifications, making it easy to integrate into various chassis and systems.

Application areas:

Communication equipment: used for telecommunications base stations, routers, switches and other devices, supporting high throughput and low latency network communication.

Industrial control: applied in industrial automation and control systems for real-time data processing and control.

Medical equipment: Used in medical imaging and data processing devices, providing high-performance computing capabilities.

Military and Defense: Suitable for military and defense applications that require strict environmental and performance standards.

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