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Radisys 63-309-0026 CPU板

发布时间:2024-08-09人气:
  • Radisys 63-309-0026  CPU板
  • Radisys 63-309-0026  CPU板
  • Radisys 63-309-0026  CPU板

Radisys 63-309-0026  CPU板  是一款用于工业和嵌入式系统的CPU板,设计用于提供强大的处理能力和可靠的计算性能。

Radisys 63-309-0026  CPU板  详情介绍: 

Radisys 63-309-0026 是一款用于工业和嵌入式系统的CPU板,设计用于提供强大的处理能力和可靠的计算性能。以下是关于该CPU板的详细信息:

主要功能和特点

  1. 处理器:

    • 处理器类型: 支持高性能的处理器,可能包括Intel的Xeon或Core系列处理器,或者AMD的处理器,具体取决于板子的配置。
    • 多核处理: 配备多核处理器,以支持并行处理和多任务运行,提高系统的整体性能。
  2. 内存:

    • 内存插槽: 提供多个内存插槽,支持DDR3、DDR4或其他类型的内存,允许用户根据需求扩展内存容量。
    • 最大内存容量: 支持大容量内存配置,以满足高性能计算和数据处理需求。
  3. 存储接口:

    • SATA 接口: 配备多个SATA接口,用于连接硬盘驱动器(HDD)或固态硬盘(SSD),以支持数据存储。
    • M.2 或 NVMe: 可能支持高速存储选项,如M.2接口或NVMe SSD,提供更高的数据传输速度。
  4. 扩展插槽:

    • PCI/PCIe 插槽: 配备多个PCI或PCIe插槽,用于安装额外的扩展卡,如网络卡、图形卡等,以增加系统的功能和灵活性。
    • 模块化设计: 允许根据需要选择和更换扩展卡,适应不同的应用需求。
  5. 网络接口:

    • 以太网接口: 通常配备多个以太网接口,如千兆以太网(1G)或万兆以太网(10G),用于高速网络连接和数据传输。
    • 无线选项: 可能支持无线网络接口,如Wi-Fi或Bluetooth,具体取决于板子的配置。
  6. I/O 接口:

    • USB 接口: 提供多个USB接口,用于连接外部设备,如鼠标、键盘和外部存储设备。
    • 串行和并行接口: 支持传统的串行(COM)和并行(LPT)接口,用于连接各种工业设备。
  7. 显示接口:

    • 视频输出: 配备视频输出接口,如VGA、DVI、HDMI或DisplayPort,支持连接显示器。
    • 高分辨率支持: 支持高分辨率显示,适用于需要高图像质量的应用场景。
  8. 电源管理:

    • 电源接口: 提供标准电源接口,通常支持工业级电源输入,确保稳定的电力供应。
    • 电源保护: 具备电源保护功能,如过电流保护和短路保护,以保障系统的稳定运行。
  9. 散热和冷却:

    • 散热设计: 配备散热片或风扇,帮助管理CPU和其他组件的温度,确保系统在高负荷下稳定运行。
    • 通风设计: 优化的散热设计,增强系统的散热性能和稳定性。
  10. 工业认证:

    • 可靠性: 符合工业标准,具备较高的可靠性和耐用性,适用于各种严苛的工业环境。

Radisys 63-309-0026  CPU板 实物图片:

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english introduction:

Radisys 61-0283-31 is a CPU circuit board widely used in industrial computers and embedded systems. The following is the detailed information of the CPU circuit board:

Main functions and features

Processor:

Processor type: It may support various high-performance processors, such as Intel's Xeon or Core series, or AMD's Ryzen series, depending on the configuration of the board.

Multi core processing: Supports multi-core processors, providing powerful computing and multitasking capabilities.

Memory:

Memory Slot: Equipped with multiple memory slots, typically supporting DDR3 or DDR4 memory, allowing users to expand memory capacity as needed.

Maximum memory capacity: Designed to support large capacity memory to meet high-performance computing requirements.

Storage interface:

SATA interface: Provides multiple SATA interfaces for connecting hard disk drives (HDD) or solid state drives (SSD) for data storage.

M. 2 or NVMe: may support higher speed storage options such as M.2 interface or NVMe SSD.

Expansion slot:

PCI/PCIe slots: Equipped with multiple PCI or PCIe slots, supporting the installation of additional expansion cards such as network interface cards, graphics cards, etc.

Modular design: supports adding or replacing expansion cards according to requirements, improving the flexibility and functional scalability of the system.

Network interface:

Ethernet interface: Typically equipped with multiple Ethernet interfaces, such as Gigabit Ethernet (1G) or 10 Gigabit Ethernet (10G), used for high-speed network connections and data transmission.

Wireless options: may support wireless network interfaces such as Wi Fi or Bluetooth, depending on the configuration.

I/O interface:

USB interface: Provides multiple USB interfaces for connecting external devices such as mice, keyboards, and external storage.

Serial and parallel interfaces: Supports traditional serial (COM) and parallel (LPT) interfaces for connecting various industrial devices.

Display interface:

Video output: Equipped with video output interfaces such as VGA, DVI, HDMI, or DisplayPort, supporting connection to a monitor.

High resolution support: Supports high-resolution display, suitable for applications that require high image quality.

Power management:

Power interface: Provides standard power interface, usually supporting industrial grade power input.

Power protection: Equipped with power protection functions such as overcurrent protection and short circuit protection to ensure stable operation.

Heat dissipation and cooling:

Heat dissipation design: Equipped with heat sinks or fans to help manage the temperature of the CPU and other components.

Ventilation design: Optimized heat dissipation design ensures stable operation of the system under high loads.

Industrial certification:

Reliability: Compliant with industrial standards, with high reliability and durability, suitable for harsh industrial environments

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