LAM 839-019090-620静电夹

LAM 839-019090-620静电夹 

1.产 品 资 料 介 绍：

中文资料：

839-019090-620 是 LAM Research 生产的一款静电夹（Electrostatic Chuck，ESC），主要用于半导体制造过程中硅片的夹持和固定。

主要特点：

• 高精度夹持： 通过静电力精确固定硅片，确保在加工过程中硅片的稳定性和位置精度。
• 广泛应用： 适用于化学气相沉积（CVD）、物理气相沉积（PVD）、刻蚀（Etching）等半导体制造工艺。
• 高可靠性： 设计用于满足半导体制造环境的高要求，具有优异的耐用性和稳定性。

应用领域：

该静电夹广泛应用于半导体制造行业，特别是在以下工艺中：

• 化学气相沉积（CVD）： 用于在硅片表面沉积薄膜。
• 物理气相沉积（PVD）： 用于在硅片表面沉积金属或其他材料。
• 刻蚀（Etching）： 用于在硅片上刻蚀图案。

维护与更换：

长期使用可能导致静电夹性能下降，定期检查和更换该模块可以确保半导体制造过程的稳定性和高效运行。

英文资料：

839-019090-620 is an electrostatic chuck (ESC) produced by LAM Research, mainly used for clamping and fixing silicon wafers in the semiconductor manufacturing process.

Main features:

High precision clamping: By precisely fixing the silicon wafer with electrostatic force, the stability and positional accuracy of the silicon wafer are ensured during the processing.

Widely applicable: Suitable for semiconductor manufacturing processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), etching, etc.

High reliability: designed to meet the high requirements of semiconductor manufacturing environments, with excellent durability and stability.

Application areas:

This electrostatic clamp is widely used in the semiconductor manufacturing industry, especially in the following processes:

Chemical Vapor Deposition (CVD): Used for depositing thin films on the surface of silicon wafers.

Physical Vapor Deposition (PVD): Used for depositing metals or other materials on the surface of silicon wafers.

Etching: Used for etching patterns on silicon wafers.

Maintenance and replacement:

Long term use may lead to a decrease in the performance of the electrostatic clamp. Regular inspection and replacement of this module can ensure the stability and efficient operation of the semiconductor manufacturing process.

2.产      品      展      示      

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