MKS AX7695远程等离子源

MKS AX7695远程等离子源

1.产 品 资 料 介 绍：

中文资料：

MKS AX7695 是 MKS Instruments 生产的一款远程等离子源，主要用于半导体制造过程中提供反应性气体。

主要特点：

• 高性能： 提供高达 6.0 标准升每分钟（slm）的氧气或氧氮混合气体流量，满足半导体加工对反应性气体的需求。
• 多种气体供应： 支持 100% 氧气、氩气或 90% 氧气/10% 氮气的点燃气体供应，适应不同的工艺要求。
• 集成设计： 将石英真空腔体、射频（RF）电源和所有必要的控制功能集成在一个紧凑的自包含单元中，便于直接安装在工具的工艺腔室上。
• 高可靠性： 设计用于满足半导体制造环境的高要求，具有优异的耐用性和稳定性。

应用领域：

该远程等离子源广泛应用于半导体制造行业，特别是在以下工艺中：

• 薄膜沉积： 用于在硅片表面沉积薄膜。
• 刻蚀： 用于在硅片上刻蚀图案。
• 清洗： 用于清洗硅片表面，去除有机污染物。

维护与更换：

长期使用可能导致模块性能下降，定期检查和更换该模块可以确保工艺过程的稳定性和高效运行。

英文资料：

MKS AX7695 is a remote plasma source produced by MKS Instruments, mainly used to provide reactive gases in semiconductor manufacturing processes.

Main features:

High performance: Provides up to 6.0 standard liters per minute (slm) of oxygen or oxygen nitrogen mixed gas flow, meeting the reactive gas requirements for semiconductor processing.

Multiple gas supply: Supports ignition gas supply of 100% oxygen, argon, or 90% oxygen/10% nitrogen to meet different process requirements.

Integrated design: Integrating the quartz vacuum chamber, radio frequency (RF) power supply, and all necessary control functions into a compact self-contained unit, making it easy to install directly on the tool's process chamber.

High reliability: designed to meet the high requirements of semiconductor manufacturing environments, with excellent durability and stability.

Application areas:

This remote plasma source is widely used in the semiconductor manufacturing industry, especially in the following processes:

Thin film deposition: used to deposit thin films on the surface of silicon wafers.

Etching: Used to etch patterns on silicon wafers.

Cleaning: Used to clean the surface of silicon wafers and remove organic pollutants.

Maintenance and replacement:

Long term use may lead to a decrease in module performance. Regular inspection and replacement of the module can ensure the stability and efficient operation of the process.

2.产      品      展      示      

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