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MKS AX7710SM-01远程等离子源

发布时间:2025-03-06人气:904
  • MKS AX7710SM-01远程等离子源
  • MKS AX7710SM-01远程等离子源
  • MKS AX7710SM-01远程等离子源

MKS AX7710SM-01远程等离子源

1.产 品 资 料 介 绍:

中文资料:

MKS AX7710SM-01 是一款远程等离子源(Remote Plasma Source, RPS),主要用于半导体制造、平板显示制造和其他高精度工业领域。以下是其主要应用领域和特点:


主要应用领域

  1. 半导体制造

    • 用于晶圆清洗、刻蚀和薄膜沉积工艺,去除光刻胶和残留物。

    • 在先进封装技术中,用于表面处理和清洁。

  2. 平板显示制造

    • 用于 LCD 和 OLED 面板制造中的清洗和表面处理,提高显示质量。

    • 在薄膜晶体管(TFT)制造中,用于刻蚀和沉积工艺。

  3. 太阳能电池制造

    • 用于硅片清洗和表面处理,提高太阳能电池效率。

    • 在薄膜太阳能电池制造中,用于刻蚀和沉积工艺。

  4. 光学器件制造

    • 用于镜头、棱镜等光学元件的清洗和表面处理,提高光学性能。

  5. 科研与实验室

    • 用于材料表面改性、薄膜沉积和等离子体研究。


产品特点

  • 高效清洗:通过远程等离子技术,实现高效、均匀的表面清洗。

  • 低损伤:减少对敏感材料的损伤,适合高精度工艺。

  • 灵活配置:可适配多种气体(如 O₂、H₂、N₂、CF₄ 等),满足不同工艺需求。

  • 高稳定性:采用先进的控制技术,确保长时间稳定运行。

  • 易于集成:模块化设计,便于集成到现有设备中。

  • 低维护:设计简洁,维护成本低。

英文资料:

MKS AX7710SM-01 is a Remote Plasma Source (RPS) primarily used in semiconductor manufacturing, flat panel display manufacturing, and other high-precision industrial fields. The following are its main application areas and characteristics:

Main application areas

Semiconductor Manufacturing

Used for wafer cleaning, etching, and thin film deposition processes to remove photoresist and residues.

In advanced packaging technology, it is used for surface treatment and cleaning.

Flat panel display manufacturing

Used for cleaning and surface treatment in LCD and OLED panel manufacturing to improve display quality.

Used for etching and deposition processes in thin film transistor (TFT) manufacturing.

Manufacturing of solar cells

Used for silicon wafer cleaning and surface treatment to improve the efficiency of solar cells.

In the manufacturing of thin-film solar cells, it is used for etching and deposition processes.

Optical device manufacturing

Used for cleaning and surface treatment of optical components such as lenses and prisms to improve optical performance.

Research and Laboratory

Used for material surface modification, thin film deposition, and plasma research.

Product Features

Efficient cleaning: Through remote plasma technology, efficient and uniform surface cleaning is achieved.

Low damage: reduces damage to sensitive materials and is suitable for high-precision processes.

Flexible configuration: can adapt to multiple gases (such as O ₂, H ₂, N ₂, CF ₄, etc.) to meet different process requirements.

High stability: Advanced control technology is adopted to ensure long-term stable operation.

Easy to integrate: Modular design makes it easy to integrate into existing devices.

Low maintenance: The design is simple and the maintenance cost is low.

2.产      品      展      示      

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